Printed Electronics: Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper’s Bulk Conductivity

Citation:

Yitzchak Rosen, Grouchko, Michael , and Magdassi, Shlomo . 2015. “Printed Electronics: Printing A Self-Reducing Copper Precursor On 2D And 3D Objects To Yield Copper Patterns With 50% Copper’s Bulk Conductivity”. Advanced Materials Interfaces, 2, Pp. 1400448. doi:10.1002/admi.201570014.

Abstract:

The patterning of various 2D and 3D substrates is accomplished using a new method, reactive transfer printing, combined with a self-reducing copper precursor. The ink composed of the metal precursor is printed on a donor substrate; during its decomposition, the metal is transferred to an acceptor substrate. This process is demonstrated with copper formate as the precursor, forming a copper pattern with excellent conductivity (50% that of bulk copper).