@article {ADMI:ADMI201570014,
	title = {Printed Electronics: Printing a Self-Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50\% Copper{\textquoteright}s Bulk Conductivity},
	journal = {Advanced Materials Interfaces},
	volume = {2},
	number = {3},
	year = {2015},
	pages = {1400448},
	abstract = {The patterning of various 2D and 3D substrates\&nbsp;is accomplished using a new method, reactive transfer printing, combined with a self-reducing copper precursor. The ink composed of the metal precursor is printed on a donor substrate; during its decomposition, the metal is transferred to an acceptor substrate. This process is demonstrated with copper formate as the precursor, forming a copper pattern with excellent conductivity (50\% that of bulk copper).},
	keywords = {conductive materials, copper formate, cuprous formate, inks, printed electronics},
	issn = {2196-7350},
	doi = {10.1002/admi.201570014},
	author = {Rosen, Yitzchak and Grouchko, Michael and Magdassi, Shlomo}
}
