@article {Tan2023-sc,
	title = {Fabrication Approaches of Soft Electronics},
	journal = {ACS Applied Electronic Materials},
	volume = {5},
	number = {3},
	year = {2023},
	pages = {1376{\textendash}1393},
	publisher = {American Chemical Society},
	abstract = {The use of conductive materials to be printed/embedded onto/within a polymeric matrix has gained increasing attention in the fabrication of next-generation soft electronics. In this review, we provide a comprehensive overview of the materials and approaches for the fabrication of 2D and 3D conductive structures while focusing on the importance of the compatibility between the particles{\textquoteright} shape, the polymeric matrix type, and the deposition method, along with the target application. The review presents a summary of the main conductive materials and the type of polymeric materials which were utilized for fabricating soft electronic devices that are bendable/twistable and stretchable. It is divided into two sections: Introduction section, which presents briefly conductive materials, polymeric matrix, and fabrication methods, and Fabrication section, presenting the main 6 approaches of fabrication. Each of the fabrication subsections presents the main recent reports in a detailed table. The review is concluded with an Outlook section, describing the current challenges in this field. Despite the progress in the fabrication of 2D bendable/twistable electronic devices toward industrial integration, there is still a need for tailoring and improving the durability and robustness of 3D stretchable electronic devices.},
	keywords = {2D printed sensors, 3D printed sensors, printed electronics, soft electronics, soft sensors},
	author = {Tan, Joel Ming Rui and Farraj, Yousef and Kamyshny, Alexander and Magdassi, Shlomo}
}
