Abstract:

During decomposition of copper formate, a volatile intermediate is formed, that can be utilized to fabricate conductive copper lines for electrical interconnections. By the method called Reactive Transfer Printing (RTP), a pattern of copper (II) formate was printed, and placed adjacent to a second surface; decomposition of the printed pattern led to a transfer of copper to the second substrate. It was found that the yield of the transfer process improved due to presence of several carboxylic acids which are liquid with a high boiling point. Furthermore we found that the transport of copper starts at a lower temperature than previously reported, indicating that the first decomposition step of copper formate is related to the catalytic decomposition of formic acid on a copper surface. The findings enable printing of conductive copper patterns onto the interior surface of a glass vessel.